Form. Fit.
Function.
The world of power electronics is constantly pushing the limits of physics. ETD specializes in designing thermally optimized enclosures and cooling solutions, that will not only protect your electronics from the elements, but also protect them from overheating.
// Form · Fit · Function
Three disciplines.
One enclosure.
Mechanically sound housings designed to the needs of your electronics — tackling any environment, with an emphasis on structural and thermal feasibility.
We adhere to an iterative process where each iteration builds on the last. Always striving to optimize interconnectivity, ease of assembly, thermal performance.
Our enclosure and cooling systems design process is guided every step of the way by parametric thermal analysis. This enables us to explore all viable design paths in a quick and efficient manner, assuring the optimal design is found without wasting time or resources.
// Cooling Solutions
From heat sink to cold plate.
Custom cooling system design for any power density, any design constraint,
Custom enclosure + cooling system, wrapped up in one efficient package.
Parametric fin profiling — height, width, count — optimized with CFD studies.
Efficiently spread heat from higher density loads while remaining versatile.
Specializing in both direct-to-chip and immersion for ultra-high power densities.
// enclosure = 250 W, pin fin heat sinks, embedded blowers
Two embedded blowers forcing air over pressurized, pin fin heat sinks. Maximize efficiency, minimize space.
// Retrofit
Existing enclosures.
Thermal upgrade.
// available_for = existing_enclosure | existing_cooling
These services are also available for existing enclosure/cooling system designs in need of a thermal upgrade. Drop us a brief with your current geometry, cooling system design, and target ΔT — we'll come back with a feasibility report. Free of charge
// Why ETD
Three design stages.
One signed-off unit.
At the conclusion of each stage ETD will host a brief product development meeting with the customer, where we will assess progress and discuss next steps.
// stages = [proof_of_concept, parametric_refinement, finalization]
- S1STAGE.01
Proof of Concept
ETD will first generate one or more low resolution, draft housings/layouts. Each draft is run through thermal simulations, configured according to the prerequisite data supplied by the customer — testing the overall viability of the concept.
- S2STAGE.02
Parametric Refinement
Refining the top one or two performing concept models through parametric iteration. By modeling then simulating an array of heatsinks featuring various fin heights, fin widths, and total number of fins, we can predict which fin profile will be optimal.
- S3STAGE.03
Finalization
Chamfers, fillets, labels, etchings — and all documentation, including drawing packages and the final thermal report. ETD holds a very thorough design review before close-out and delivery.
- ▸Thermal Analysis Report
- ▸Part and Assembly Drawing Packages (.dwg, .dxf, .pdf)
- ▸Part and Assembly Models (.stp)
- ▸Sourcing of Metalwork (if requested)
- ▸Technical Explosion Animation (if requested)
// Engage ETD
Ship an enclosure that runs cold.
Send us a brief — your design constraints, your geometries, your final vision — and we'll come back with a feasibility report. Free of charge.